The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

Materials Science and Engineering: A

Volumn 445-446, Issue , 2007, Pages 620-624

  Miyamura, T ^a   Koike, J ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Copper; Degradation; Interface; Oxidation; Polyimide; Strength

Indexed keywords

ANNEALING; CHROMIUM; COPPER; DEGRADATION; OXIDATION; POLYIMIDES;

CARBONYL BONDS; FAILURE MODE; FLEXIBLE FILMS; INTERFACE ADHESION STRENGTH;

ADHESION;

ADHESION; ANNEALING; CHROMIUM; COPPER; DEGRADATION; OXIDATION; POLYIMIDES;

EID: 33845907926     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.09.097     Document Type: Article

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