Adhesion energy of Cu/polyimide interface in flexible printed circuits

Surface and Coatings Technology

Volumn 202, Issue 4-7, 2007, Pages 1084-1088

  Kamiya, Shoji ^a   Furuta, Harunori ^a   Omiya, Masaki ^b  

^a NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Adhesion; Cu polyimide interface; Energy; Flexible printed circuit; Plastic deformation; Strength

Indexed keywords

CRACK EXTENSION; FLEXIBLE PRINTED CIRCUITS; INTERFACIAL ADHESION ENERGY; POLYIMIDE INTERFACE;

ADHESION; COMPUTER SIMULATION; COPPER; CRACKS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; PLASTIC DEFORMATION; POLYIMIDES;

PRINTED CIRCUITS;

ADHESION; COMPUTER SIMULATION; COPPER; CRACKS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; PLASTIC DEFORMATION; POLYIMIDES; PRINTED CIRCUITS;

EID: 36048968863     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.07.061     Document Type: Article

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