SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 46-53

Effect of Ni-Cr layer on adhesion strength of flexible copper clad laminate

(2) Noh, Bo In a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

Author keywords

Adhesion strength; Flexible copper clad laminate; Ni Cr layer; Sputtering

Indexed keywords

ADHESION PROPERTIES; ADHESION STRENGTH; ATOMIC FORCES; CHEMICAL COMPOSITIONS; CHEMICAL FUNCTIONS; FLEXIBLE COPPER CLAD LAMINATE; FRACTURE SURFACES; HOLDING TIMES; NI-CR LAYER; PEEL STRENGTHS; PEEL TESTS; THERMAL RESISTANCES; THERMAL TREATMENTS; X-RAY PHOTOELECTRON SPECTROSCOPIES;

ADHESION; ARCHITECTURAL DESIGN; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); CHEMICAL PROPERTIES; CHROMIUM; COPPER; HEAT TREATMENT; HYDROGEN EMBRITTLEMENT; INORGANIC COATINGS; NICKEL; PHOTOELECTRON SPECTROSCOPY; POLYIMIDES; POLYMERS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

LAMINATES;

EID: 57649234856 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0543-z Document Type: Conference Paper

Times cited : (14)

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