SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 9, 2009, Pages 885-890

Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

(4) Noh, Bo In a Yoon, Jeong Won a Lee, Bo Young b Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

b Hankuk Aviation University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

[CARBONYL; ADHESION CHARACTERISTIC; ADHESION PROPERTIES; ADHESION STRENGTHS; COMPOSITION RATIO; CR CONTENT; CU ELECTROPLATING; FLEXIBLE COPPER CLAD LAMINATE; LAYER THICKNESS; PEEL STRENGTH; PEEL TESTS; SEM;

ADHESION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); CHEMICAL BONDS; CHROMIUM; ELECTRONICS PACKAGING; INORGANIC COATINGS; LAMINATES; NICKEL; POLYIMIDES; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 68249123586 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-008-9811-1 Document Type: Article

Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.