Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Journal of Materials Research

Volumn 26, Issue 8, 2011, Pages 983-991

  Chen, Hsiao Yun ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Diffusion; Packaging

Indexed keywords

COPPER ATOMS; CU-SN INTERMETALLICS; CURRENT FLOWING; CURRENT FLOWS; ELECTROMIGRATION FORCES; FLIP CHIP; PB-FREE; SN-AG SOLDER; SOLDER JOINTS; THEORETICAL CALCULATIONS; THERMOMIGRATION;

CHIP SCALE PACKAGES; ELECTROMIGRATION; INTERMETALLICS; LEAD; LEAD COMPOUNDS; SOLDERING ALLOYS; THERMAL GRADIENTS;

TIN;

EID: 79959381371     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2011.25     Document Type: Article

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