Effect of indium content and rapid solidification on microhardness and micro-creep of Sn-Zn eutectic lead free solder alloy

Crystal Research and Technology

Volumn 45, Issue 4, 2010, Pages 427-432

  Shalaby, R M ^a  

^a Mansoura University   (Egypt)

Author keywords

Lead free solder; Melting point; Micro creep; Microhardness; Rapid solidification; Sn Zn In

Indexed keywords

ALLOYING ADDITIONS; AXIAL RATIO; BINARY SYSTEMS; DYNAMIC YOUNG'S MODULUS; EFFECTIVE GRAIN SIZE; ELECTRICAL RESISTIVITY; INDIUM CONTENT; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDER; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MATRIX; MECHANICAL STRENGTH; MELTING TEMPERATURES; MICRO-CREEP; TERNARY ADDITION; UNIT CELLS; YOUNG'S MODULUS;

CERIUM ALLOYS; CREEP; CREEP RESISTANCE; CRYSTALLIZATION; ELASTIC MODULI; ELASTICITY; ELECTRIC CONDUCTIVITY; INDIUM; INDIUM ALLOYS; LEAD; MELTING POINT; MICROHARDNESS; PRECIPITATION (CHEMICAL); RAPID SOLIDIFICATION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

TIN;

EID: 77950821566     PISSN: 02321300     EISSN: 15214079     Source Type: Journal    
DOI: 10.1002/crat.201000022     Document Type: Article

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