Fabrication of metallic microstructure on curved substrate by optical soft lithography and copper electroplating

Sensors and Actuators, A: Physical

Volumn 168, Issue 1, 2011, Pages 105-111

  Park, Jongho ^a   Fujita, Hiroyuki ^a   Kim, Beomjoon ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

Copper electroplating; Curved substrate; Microfabrication; Nonplanar substrate; SU 8

Indexed keywords

COPPER ELECTROPLATING; COPPER STRUCTURES; CURVED SUBSTRATE; CURVED SUBSTRATES; DIRECT METAL TRANSFER; FABRICATION METHOD; FLEXIBLE POLYMERS; GLASS SUBSTRATES; HIGH ASPECT RATIO; METAL ELECTROPLATING; METALLIC MICROSTRUCTURES; MICRO PATTERN; MICRO-FABRICATION TECHNIQUES; MICROLINE; NON-PLANAR SUBSTRATES; NONPLANAR SUBSTRATE; SOFT LITHOGRAPHY; SU-8;

ASPECT RATIO; COPPER; ELECTROPLATING; LITHOGRAPHY; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; MICROSTRUCTURE; PHOTOMASKS; SELF ASSEMBLED MONOLAYERS;

SUBSTRATES;

EID: 79956361438     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2011.03.024     Document Type: Article

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