Micro heat flux sensor using copper electroplating in SU-8 microstructures

Journal of Micromechanics and Microengineering

Volumn 11, Issue 3, 2001, Pages 221-225

  Hwan Oh, Seok ^a   Lee, Kwang Cheol ^a   Chun, Jaechul ^a   Kim, Moohwan ^a   Lee, Seung S ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; HEAT FLUX; HEAT TRANSFER; SENSORS; THERMOCOUPLES; THERMOPILES;

HEAT FLUX SENSORS;

MICROSTRUCTURE;

EID: 0343773239     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/3/310     Document Type: Article

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