Pull force and tail breaking force optimization of the crescent bonding process with insulated Au wire

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 725-730

  Lee, J ^a   Mayer, M ^a   Zhou, Y ^a   Persic, J ^b  

^a Microjoining Lab

^b Microbonds Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BONDABILITY; BONDING PROCESSES; BREAKING FORCES; ITERATION METHODS; PACKAGING TECHNOLOGIES; PULL FORCE; ULTRASONIC AMPLITUDE; ULTRASONIC POWERS; WIRE BOND;

ELECTRONICS PACKAGING; ITERATIVE METHODS; MANGANESE COMPOUNDS; OPTIMIZATION; TECHNOLOGY; ULTRASONIC CLEANING; ULTRASONICS; WIRE;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049096453     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469818     Document Type: Conference Paper

References (7)

1. "Assmbly and Packaging" ITRS 2006 update, pp. 1-19
2. K. S. Goh, Z. W. Zhong, "Capillary solutions for ultrafine-pitch wire bonding and insulated wire bonding", Microelectronic Eng. Vol. 84, No. 2 (2007), pp. 362-367.
3. J. Lee, M. Mayer, Y. Zhou, S. J. Hong, "Iterative Optimization of Tail Breaking Force of 1mil Wire Thermosonic Ball Bonding Processes and the Influence of Plasma Cleaning" in press in Microelectronics Journal.
4. J. Lee, M. Mayer, Y. Zhou, S. J. Hong, and S. M. Lee, "Tail breaking force in thermosonic wire bonding with novel bonding wires", Proc IWJC-Korea, Seoul, Korea, 2007, pp. 271.
5. J. Beleran, A. Turiano, D. M. Calpito, D. Stephan, Saraswati, F. Wulff, and C Breach "Tail Pull Strength of Cu wire on Gold and Silver-plated Bonding leads" Proc. SEMICON, Singapore (2005), pp. 1-8.
6. Y. N. Zhou, X. Li, N. J. Noolu, "footprint study of bond initiation in gold wire crescent bonding" IEEE Trans. Comp. Packag. Technol., Vol 28, No. 4 (2005), pp. 810-816.
7. M. Weissenfelt, P. Collander, E. Jarvinen, T. Laurinolli, "practical method for evaluating and adjusting ultrasonic wire bonding process", Proc. 29th Electro. Comp. Conf. Cherry Hill, N. J. USA (1979), pp. 309-314.