Microfabricated, ultra-dense, three-dimensional metal coils

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 1718-1721

  Herrault, F ^a   Yorish, S ^b   Crittenden, T ^b   Allen, M G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Virtual AeroSurface Technologies   (United States)

Author keywords

Chemical vapor deposition; High aspect ratio; Metal MEMS; Micro coils; Parylene

Indexed keywords

ELECTRODEPOSITED METALS; HIGH ASPECT RATIO; HIGH PACKING DENSITY; METAL MICROSTRUCTURE; MICROCOILS; MICROFABRICATED; PACKING DENSITY; PARYLENES;

ACTUATORS; ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; MICROSYSTEMS; PHOTORESISTS; PIEZOELECTRIC TRANSDUCERS; PRESSURE DROP; THREE DIMENSIONAL;

SOLID-STATE SENSORS;

EID: 71449086869     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285733     Document Type: Conference Paper

References (6)

1. http://www.enameledwire.com/jisspecifications.aspx
2. F. Cros, M.G. Allen, "High aspect ratio structures achieved by sacrificial conformal coating," in Proc. Hilton Head 94 Workshop, June 1994.
3. F. Herrault, C.-H. Ji, S. Rajaraman, R.H. Shafer, M.G. Allen, "Electrodeposited metal structures in high aspect ratio cavities using vapor deposited polymer molds and laser micromachining," in Tech. Dig. Transducers '07, pp. 513-516, Lyon France, June 2007.
4. http://www.scscoatings.com/docs/coatspec.pdf
5. C.-H. Ji, F. Herrault, M.G. Allen, "A metallic buried interconnect process for through-wafer interconnection," J. Micromech. Microeng., vol. 18, no. 7, Aug. 2008, p. 085016 (10 pp.).
6. R. Olson, "Parylene conformal coatings and their applications for electronics," in Proc. IEEE EEIC, Sept. 1989, pp. 272-273.