Robust wirebonding of X-Wire™ insulated bonding wire technology

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 911-917

  Carr, Christopher ^a   Munar, Juan ^a   Crockett, William ^a   Lyn, Robert ^a  

^a Microbonds Inc   (Canada)

Author keywords

Advanced Packaging; Insulated bonding wire; Wire bonding

Indexed keywords

ADVANCED PACKAGING; BONDING WIRES; COST-EFFECTIVE SOLUTIONS; HIGH-DENSITY PACKAGING; SEMICONDUCTOR INDUSTRY; SEMICONDUCTOR PACKAGING; WIRE BONDING; WIRE BONDING TECHNOLOGY;

CHIP SCALE PACKAGES; LITHOGRAPHY; MICROELECTRONICS; PACKAGING; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

WIRE;

EID: 84876897069     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. ITRS roadmap 2005. http://public.itrs.net
2. John Baliga, "Insulated Bonding Wire Taking Hold", Semiconductor International, May, 2006
3. Susumu Okikawa, Michio Tanimoto, Hiroshi, Watanabe, Hiroshi, Mikino, and Tsuyoshi Kaneda, "Development of a Coated Wire Bonding Technology", IEEE Trans. Comp. Hybrids and Manuf. Tech. Vol. 12, No. 4. pp 603-608, 1989