Process for the fabrication of hollow core solenoidal microcoils in borosilicate glass

Journal of Micromechanics and Microengineering

Volumn 18, Issue 7, 2008, Pages

  Klein, Mona J K ^a,b   Ono, Takahito ^c   Esashi, Masayoshi ^c   Korvink, Jan G ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b CSEM   (Switzerland)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; ELECTROLESS PLATING; GLASS; GLASS BONDING; IMAGING TECHNIQUES; ION BEAM ASSISTED DEPOSITION; MAGNETIC FIELDS; MAGNETIC RESONANCE IMAGING; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; METALS; NONMETALS; OPTICAL DESIGN; ORGANIC CHEMICALS; ORGANIC COMPOUNDS; ORGANOMETALLICS; REACTIVE ION ETCHING; RESONANCE; SILICON; SILICON WAFERS; SOLENOIDS; VAPOR DEPOSITION; WAFER BONDING;

COIL DESIGNS; COIL DIMENSIONS; COPPER METAL; DIELECTRIC CONSTANTS; ELECTROLESS; ESSENTIAL PARAMETERS; FABRICATION METHODS; GLASS WAFERS; HIGH FILLING FACTOR; HIGH FREQUENCY OPERATIONS; HIGH RESOLUTIONS; HOLLOW CORES; LOW LOSSES; MAGNETIC RESONANCE IMAGING (MRI); MAIN PROCESS; METALLIZATION; MICRO-COILS; OPTICAL TRANSPARENCY; REACTIVE ION; REDUCED LOSSES; REGION -OF-INTEREST (ROI); SOLENOIDAL COILS; SUBSTRATE MATERIALS; WALL THICKNESSES;

BOROSILICATE GLASS;

EID: 47249113358     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/7/075002     Document Type: Article

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