Testing semiconductor devices at extremely high operating temperatures

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1440-1443

  Borthen, Peter ^a   Wachutka, Gerhard ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR MATERIALS; SEMICONDUCTOR SWITCHES; SILICON CARBIDE;

ELECTROTHERMAL CHARACTERIZATION; HIGH TEMPERATURES; MEASUREMENT SET-UP; MEASUREMENT SYSTEMS; MOUNTING TECHNIQUES; OPERATING TEMPERATURES; ROOM TEMPERATURES; SIC DEVICES; TEMPERATURE RANGES; VACUUM SYSTEMS;

SEMICONDUCTOR DEVICES;

EID: 50249090070     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.037     Document Type: Article

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