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Journal of Vacuum Science and Technology B

Volumn 29, Issue 1, 2011, Pages 0110041-0110045

Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate

(5) Cho, Sung Ki a Kim, Myung Jun a Lim, Taeho a Kwon, Oh Joong b Kim, Jae Jeong a

a Seoul National University (South Korea)

b SolarLight Ltd (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER DEPOSITS; DEPOSITS; METALLIC FILMS; PHYSICAL VAPOR DEPOSITION;

FILM CHARACTERISTICS; OBLIQUE ANGLES; PATTERNED STRUCTURE; PATTERNED SUBSTRATES; POSITION DEPENDENTS; PULSE REVERSE PLATING; REVERSE CURRENTS; THERMAL PRE-TREATMENT;

PLATING;

EID: 79551628845 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3521508 Document Type: Conference Paper

Times cited : (4)

References (29)

1
- 38949134530
- 0013-4686, 10.1016/j.electacta.2007.11.054
- M. S. Chandrasekar and M. Pushpavanam, Electrochim. Acta 0013-4686 53, 3313 (2008). 10.1016/j.electacta.2007.11.054
- (2008) Electrochim. Acta , vol.53 , pp. 3313
- Chandrasekar, M.S.¹ Pushpavanam, M.²

2
- 0036504144
- 0013-4651, 10.1149/1.1469028
- D. Landolt, J. Electrochem. Soc. 0013-4651 149, S9 (2002). 10.1149/1.1469028
- (2002) J. Electrochem. Soc. , vol.149 , pp. 9
- Landolt, D.¹

3
- 0036607847
- Modeling of transient electrochemical systems involving moving boundaries. Parametric study of pulse and pulse-reverse plating of copper in trenches
- DOI 10.1149/1.1471890
- M. Georgiadou and D. Veyret, J. Electrochem. Soc. 0013-4651 149, C324 (2002). 10.1149/1.1471890 (Pubitemid 34697439)
- (2002) Journal of the Electrochemical Society , vol.149 , Issue.6
- Georgiadou, M.¹ Veyret, D.²

4
- 0032166866
- 0013-4651, 10.1149/1.1838766
- A. C. West, C. -C. Cheng, and B. C. Baker, J. Electrochem. Soc. 0013-4651 145, 3070 (1998). 10.1149/1.1838766
- (1998) J. Electrochem. Soc. , vol.145 , pp. 3070
- West, A.C.¹ Cheng, C.-C.² Baker, B.C.³

5
- 65449160492
- 0013-4651, 10.1149/1.3111036
- M. Hayase and M. Nagao, J. Electrochem. Soc. 0013-4651 156, D198 (2009). 10.1149/1.3111036
- (2009) J. Electrochem. Soc. , vol.156 , pp. 198
- Hayase, M.¹ Nagao, M.²

6
- 0025402227
- 0021-891X, 10.1007/BF01033595
- T. Pearson and J. K. Dennis, J. Appl. Electrochem. 0021-891X 20, 196 (1990). 10.1007/BF01033595
- (1990) J. Appl. Electrochem. , vol.20 , pp. 196
- Pearson, T.¹ Dennis, J.K.²

7
- 0037840575
- 0013-4651, 10.1149/1.1560942
- W. -C. Tsai, C. -C. Wan, and Y. -Y. Wang, J. Electrochem. Soc. 0013-4651 150, C267 (2003). 10.1149/1.1560942
- (2003) J. Electrochem. Soc. , vol.150 , pp. 267
- Tsai, W.-C.¹ Wan, C.-C.² Wang, Y.-Y.³

8
- 0037594064
- 0013-4651, 10.1149/1.1573198
- K. -M. Yin, J. Electrochem. Soc. 0013-4651 150, C435 (2003). 10.1149/1.1573198
- (2003) J. Electrochem. Soc. , vol.150 , pp. 435
- Yin, K.-M.¹

9
- 27644459510
- Impact of pulse parameters on current distribution in high aspect ratio vias and through-holes
- DOI 10.1149/1.2001188
- J. -M. Lee and A. C. West, J. Electrochem. Soc. 0013-4651 152, C645 (2005). 10.1149/1.2001188 (Pubitemid 41549475)
- (2005) Journal of the Electrochemical Society , vol.152 , Issue.10
- Lee, J.-M.¹ West, A.C.²

10
- 0038608067
- 0013-4651, 10.1149/1.1572154
- J. -J. Sun, K. Kondo, T. Okamura, S. Oh, M. Tomisaka, H. Yonemura, M. Hoshino, and K. Takahashi, J. Electrochem. Soc. 0013-4651 150, G355 (2003). 10.1149/1.1572154
- (2003) J. Electrochem. Soc. , vol.150 , pp. 355
- Sun, J.-J.¹ Kondo, K.² Okamura, T.³ Oh, S.⁴ Tomisaka, M.⁵ Yonemura, H.⁶ Hoshino, M.⁷ Takahashi, K.⁸

11
- 27944488000
- High-aspect-ratio copper-via-filling for three-dimensional chip stacking II. reduced electrodeposition process time
- DOI 10.1149/1.2041047
- K. Kondo, T. Yonezawa, D. Mikami, T. Okubo, Y. Taguchi, K. Takahashi, and D. P. Barkey, J. Electrochem. Soc. 0013-4651 152, H173 (2005). 10.1149/1.2041047 (Pubitemid 41680895)
- (2005) Journal of the Electrochemical Society , vol.152 , Issue.11
- Kondo, K.¹ Yonezawa, T.² Mikami, D.³ Okubo, T.⁴ Taguchi, Y.⁵ Takahashi, K.⁶ Barkey, D.P.⁷

12
- 33745482433
- Copper electroplating to fill blind vias for three-dimensional integration
- DOI 10.1116/1.2206193, 107604JVA
- S. Spiesshoefer, J. Vac. Sci. Technol. A 0734-2101 24, 1277 (2006). 10.1116/1.2206193 (Pubitemid 43959153)
- (2006) Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films , vol.24 , Issue.4 , pp. 1277-1282
- Spiesshoefer, S.¹ Patel, J.² Lam, T.³ Cai, L.⁴ Polamreddy, S.⁵ Figueroa, R.F.⁶ Burkett, S.L.⁷ Schaper, L.⁸ Geil, R.⁹ Rogers, B.¹⁰

13
- 33747670896
- Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking
- DOI 10.1149/1.2236374
- P. Dixit, J. Miao, and R. Preisser, Electrochem. Solid-State Lett. 1099-0062 9, G305 (2006). 10.1149/1.2236374 (Pubitemid 44270901)
- (2006) Electrochemical and Solid-State Letters , vol.9 , Issue.10
- Dixit, P.¹ Miao, J.² Preisser, R.³

14
- 0026899768
- 0013-4651, 10.1149/1.2069523
- K. -M. Jeong, C. -K. Lee, and H. -J. Sohn, J. Electrochem. Soc. 0013-4651 139, 1927 (1992). 10.1149/1.2069523
- (1992) J. Electrochem. Soc. , vol.139 , pp. 1927
- Jeong, K.-M.¹ Lee, C.-K.² Sohn, H.-J.³

15
- 33750809401
- Leveling with step potential in damascene Cu electrodeposition
- DOI 10.1149/1.2354459, 031612JES
- S. K. Cho and J. J. Kim, J. Electrochem. Soc. 0013-4651 153, C822 (2006). 10.1149/1.2354459 (Pubitemid 44711543)
- (2006) Journal of the Electrochemical Society , vol.153 , Issue.12
- Cho, S.K.¹ Kim, J.J.²

16
- 0242499129
- Effects of deposition modes on the microstructure of copper deposits from an acidic sulfate bath
- DOI 10.1016/S0257-8972(03)00004-5
- C. -C. Hu and C. -M. Wu, Surf. Coat. Technol. 0257-8972 176, 75 (2003). 10.1016/S0257-8972(03)00004-5 (Pubitemid 37388065)
- (2003) Surface and Coatings Technology , vol.176 , Issue.1 , pp. 75-83
- Hu, C.-C.¹ Wu, C.-M.²

17
- 33845929800
- Nickel pulse reversal plating for image reversal of ultrathin electron beam resist
- DOI 10.1016/j.tsf.2006.08.016, PII S0040609006010066
- Y. Awad, E. Lavallee, J. Beauvais, D. Drouin, L. K. Mun, P. Yang, M. Cloutier, and D. Turcotte, Thin Solid Films 0040-6090 515, 3040 (2007). 10.1016/j.tsf.2006.08.016 (Pubitemid 46038441)
- (2007) Thin Solid Films , vol.515 , Issue.5 , pp. 3040-3045
- Awad, Y.¹ Lavallee, E.² Beauvais, J.³ Drouin, D.⁴ Lau Kien Mun⁵ Yang, P.⁶ Cloutier, M.⁷ Turcotte, D.⁸

18
- 0027579215
- 0013-4651, 10.1149/1.2056238
- D. L. Grimmett, M. Schwartz, and K. Nobe, J. Electrochem. Soc. 0013-4651 140, 973 (1993). 10.1149/1.2056238
- (1993) J. Electrochem. Soc. , vol.140 , pp. 973
- Grimmett, D.L.¹ Schwartz, M.² Nobe, K.³

19
- 16344381354
- Electrodeposition of Zn-Co alloys with pulse containing reverse current
- DOI 10.1016/j.electacta.2004.11.014, PII S0013468604011338
- J. -Y. Fei and G. D. Wilcox, Electrochim. Acta 0013-4686 50, 2693 (2005). 10.1016/j.electacta.2004.11.014 (Pubitemid 40467132)
- (2005) Electrochimica Acta , vol.50 , Issue.13 , pp. 2693-2698
- Fei, J.-Y.¹ Wilcox, G.D.²

20
- 21644438623
- Enhanced step coverage by oblique angle physical vapor deposition
- DOI 10.1063/1.1937476, 124504
- T. Karabacak and T. -M. Lu, J. Appl. Phys. 0021-8979 97, 124504 (2005). 10.1063/1.1937476 (Pubitemid 40925366)
- (2005) Journal of Applied Physics , vol.97 , Issue.12 , pp. 1-5
- Karabacak, T.¹ Lu, T.-M.²

21
- 0033347587
- 0272-9172.
- Q. -T. Jiang, R. Mikkola, R. Ortega, and V. Blaschke, Mater. Res. Soc. Symp. Proc. 0272-9172 562, 229 (1999).
- (1999) Mater. Res. Soc. Symp. Proc. , vol.562 , pp. 229
- Jiang, Q.-T.¹ Mikkola, R.² Ortega, R.³ Blaschke, V.⁴

22
- 0036502231
- Control of the (111) orientation in copper interconnection layer
- DOI 10.1149/1.1448186
- T. Hara, K. Sakata, and Y. Yoshida, Electrochem. Solid-State Lett. 1099-0062 5, C41 (2002). 10.1149/1.1448186 (Pubitemid 34300674)
- (2002) Electrochemical and Solid-State Letters , vol.5 , Issue.3
- Hara, T.¹ Sakata, K.² Yoshida, Y.³

23
- 0000776132
- 0021-8979, 10.1063/1.371462
- K. Ueno, T. Ritzdorf, and S. Grace, J. Appl. Phys. 0021-8979 86, 4930 (1999). 10.1063/1.371462
- (1999) J. Appl. Phys. , vol.86 , pp. 4930
- Ueno, K.¹ Ritzdorf, T.² Grace, S.³

24
- 0019691868
- Kinetics and mechanism of the anodic dissolution of phosphorus-containing copper in bright copper plating electrolytes
- DOI 10.1016/0376-4583(81)90037-6
- S. Rashkov and L. Vuchkov, Surf. Technol. 0376-4583 14, 309 (1981). 10.1016/0376-4583(81)90037-6 (Pubitemid 12506843)
- (1981) Surface technology , vol.14 , Issue.4 , pp. 309-321
- Rashkov, St.¹ Vuchkov, L.²

25
- 0025237925
- 0021-891X, 10.1007/BF01012485
- M. Drogowska, L. Brossard, and H. Ḿnard, J. Appl. Electrochem. 0021-891X 20, 150 (1990). 10.1007/BF01012485
- (1990) J. Appl. Electrochem. , vol.20 , pp. 150
- Drogowska, M.¹ Brossard, L.² Ḿnard, H.³

26
- 0037258161
- 0013-4651, 10.1149/1.1523415
- D. Padhi, J. Yahalom, S. Gandikota, and G. Dixit, J. Electrochem. Soc. 0013-4651 150, G10 (2003). 10.1149/1.1523415
- (2003) J. Electrochem. Soc. , vol.150 , pp. 10
- Padhi, D.¹ Yahalom, J.² Gandikota, S.³ Dixit, G.⁴

27
- 0001403899
- 1071-1023, 10.1116/1.590019
- K. Robbie, J. C. Sit, and M. J. Brett, J. Vac. Sci. Technol. B 1071-1023 16, 1115 (1998). 10.1116/1.590019
- (1998) J. Vac. Sci. Technol. B , vol.16 , pp. 1115
- Robbie, K.¹ Sit, J.C.² Brett, M.J.³

28
- 34548216223
- Glancing angle deposition: Fabrication, properties, and applications of micro- and nanostructured thin films
- DOI 10.1116/1.2764082
- M. M. Hawkeye and M. J. Brett, J. Vac. Sci. Technol. A 0734-2101 25, 1317 (2007). 10.1116/1.2764082 (Pubitemid 47330594)
- (2007) Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films , vol.25 , Issue.5 , pp. 1317-1335
- Hawkeye, M.M.¹ Brett, M.J.²

29
- 33747670897
- Cu electroless deposition onto Ta substrates application to create a seed layer for Cu electrodeposition
- DOI 10.1149/1.2225726
- C. H. Lee, S. Hwang, S. -C. Kim, and J. J. Kim, Electrochem. Solid-State Lett. 1099-0062 9, C157 (2006). 10.1149/1.2225726 (Pubitemid 44270892)
- (2006) Electrochemical and Solid-State Letters , vol.9 , Issue.10
- Lee, C.H.¹ Hwang, S.² Kim, S.-C.³ Kim, J.J.⁴

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