Enhanced step coverage by oblique angle physical vapor deposition

Journal of Applied Physics

Volumn 97, Issue 12, 2005, Pages

  Karabacak, Tansel ^a   Lu, Toh Ming ^a  

^a Rensselaer Polytechnic Institute   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION LAYERS; INTERLAYER DIELECTRICS (ILD); SHADOWING; VOID FORMATION;

ASPECT RATIO; COATINGS; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; IONIZATION; PHYSICAL VAPOR DEPOSITION; RUTHENIUM; SPUTTER DEPOSITION;

THIN FILMS;

EID: 21644438623     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1937476     Document Type: Article

References (7)

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4. S.-N. Mei, T.-M. Lu, and S. Robert, IEEE Electron Device Lett. 8, 506 (1987).
5. J. A. Thornton, J. Vac. Sci. Technol. A 4, 3059 (1986).
6. T. Karabacak, A. Mallikarjunan, J. P. Singh, D.-X. Ye, G.-C. Wang, and T.-M. Lu, Appl. Phys. Lett. 83, 3096 (2003).
7. I. Goswami and R. Laxman, Semicond. Int. 27, 49 (2004), and references therein.