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Volumn 145, Issue 9, 1998, Pages 3070-3074

Pulse reverse copper electrodeposition in high aspect ratio trenches and vias

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROPLATING; MATHEMATICAL MODELS; WAVEFORM ANALYSIS;

PULSE REVERSE ELECTRODEPOSITION;

COPPER PLATING;

EID: 0032166866 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1838766 Document Type: Article

Times cited : (94)

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