Nickel pulse reversal plating for image reversal of ultrathin electron beam resist

Thin Solid Films

Volumn 515, Issue 5, 2007, Pages 3040-3045

  Awad, Yousef ^a   Lavallee, Eric ^a   Beauvais, Jacques ^a   Drouin, D ^a   Lau Kien Mun, ^a   Yang, Pan ^a   Cloutier, M ^a   Turcotte, David ^a  

^a UNIVERSITÉ DE SHERBROOKE   (Canada)

Author keywords

Metallization; Nickel; Scanning electron microscopy; Silicon deposition process; Silver; Surface defects; Surface morphology

Indexed keywords

DEPOSITION; ELECTRON BEAMS; METALLIZING; NICKEL; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SURFACES;

NICKEL SULFAMATE; PULSE REVERSAL PLATING; SILICON DEPOSITION PROCESS; SURFACE DEFECTS;

ULTRATHIN FILMS;

EID: 33845929800     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.08.016     Document Type: Article

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