Effects of deposition modes on the microstructure of copper deposits from an acidic sulfate bath

Surface and Coatings Technology

Volumn 176, Issue 1, 2003, Pages 75-83

  Hu, Chi Chang ^a   Wu, Chi Ming ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Copper electroplating; Deposition mode; Microstructure; Roughness

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROPLATING; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

VOLTAMMETRY;

COPPER DEPOSITS;

ACID; COPPER; DEPOSITION; ELECTROPLATING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

EID: 0242499129     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00004-5     Document Type: Article

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