Effect of reverse pulse on copper fill

Journal of the Electrochemical Society

Volumn 156, Issue 6, 2009, Pages

  Hayase, Masanori ^a   Nagao, Masayuki ^a  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACID COPPER SULFATES; COPPER CHLORIDES; COPPER ELECTROPLATING; MIXED EFFECTS; PLATING BATHS; SOLUTION AGITATIONS;

ADSORPTION; CHLORINE COMPOUNDS; COPPER; COPPER DEPOSITS; ELECTROPLATING; ETHYLENE GLYCOL; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES;

ACCELERATION;

EID: 65449160492     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3111036     Document Type: Article

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