Modeling of transient electrochemical systems involving moving boundaries. Parametric study of pulse and pulse-reverse plating of copper in trenches

Journal of the Electrochemical Society

Volumn 149, Issue 6, 2002, Pages

  Georgiadou, M ^a   Veyret, D ^a  

^a AIX MARSEILLE UNIVERSITY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER SIMULATION; COPPER PLATING; DIFFUSION; DISSOLUTION; ELECTRODEPOSITION; FINITE DIFFERENCE METHOD; NUMERICAL METHODS;

CONVECTION; MASS TRANSPORT; MESHING; MIGRATION; PULSE REVERSE PLATING; TRANSIENT ELECTROCHEMICAL SYSTEMS; TRENCHES;

ELECTROCHEMISTRY;

EID: 0036607847     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1471890     Document Type: Article

References (14)