SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 517, Issue 5, 2009, Pages 1686-1689

Modeling the diffusion of solid copper into liquid solder alloys

(3) Rizvi, M J a Lu, H a Bailey, C a

a UNIVERSITY OF GREENWICH (United Kingdom)

Author keywords

Copper; Diffusion; Modeling; Solder

Indexed keywords

BRAZING; CERIUM ALLOYS; COMPUTER SYSTEMS; COPPER; DIFFUSION; DISSOLUTION; LEAD; LEAD ALLOYS; METALLIC COMPOUNDS; SEMICONDUCTOR DOPING; SOLDERING; SOLDERING ALLOYS; WELDING;

ANALYTICAL MODELS; COMPUTER MODELING; COPPER ATOMS; DIFFUSION COEFFICIENTS; DIFFUSION PROCESSES; LIQUID SOLDERS; MAJOR FACTORS; MODELING; MODELING RESULTS; MOLTEN SOLDERS; PB SOLDERS; SCANNING ELECTRON MICROSCOPIC; SOLDER JOINTS; SOLDERING PROCESSES;

TIN;

EID: 56949094521 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2008.09.105 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.