메뉴 건너뛰기




Volumn 152, Issue 1, 2008, Pages 37-49

Fatigue fracture of SnAgCu solder joints by microstructural modeling

Author keywords

Cohesive zone modeling; Lead free; Microstructural modeling; Solder fatigue

Indexed keywords

BRAZING; ELECTRIC CURRENTS; FATIGUE DAMAGE; FORMING; MECHANICAL PROPERTIES; OPTICAL MICROSCOPY; RELIABILITY; SOLDERING; STATISTICAL METHODS; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL; WELDING;

EID: 56349101102     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-008-9264-9     Document Type: Article
Times cited : (14)

References (29)
  • 1
    • 11244331550 scopus 로고    scopus 로고
    • Fatigue damage modeling in solder interconnects using a cohesive zone approach
    • Abdul-Baqi A, Schreurs PJG, Geers MGD (2005) Fatigue damage modeling in solder interconnects using a cohesive zone approach. Int J Solids Struct 42:927-942
    • (2005) Int J Solids Struct , vol.42 , pp. 927-942
    • Abdul-Baqi, A.1    Schreurs, P.J.G.2    Geers, M.G.D.3
  • 2
    • 77649193465 scopus 로고
    • The mathematical theory of equilibrium cracks in brittle fracture
    • Barenblatt GI (1962) The mathematical theory of equilibrium cracks in brittle fracture. Adv Appl Mech VII:55-129
    • (1962) Adv Appl Mech , vol.6 , pp. 55-129
    • Barenblatt, G.I.1
  • 3
    • 0035857687 scopus 로고    scopus 로고
    • Interface debonding models: A viscous regularization with a limited rate dependency
    • Chaboche JL, Feyel F, Monerie Y (2001) Interface debonding models: A viscous regularization with a limited rate dependency. Int J Solids Struct 38:3127-3160
    • (2001) Int J Solids Struct , vol.38 , pp. 3127-3160
    • Chaboche, J.L.1    Feyel, F.2    Monerie, Y.3
  • 4
    • 0033131851 scopus 로고    scopus 로고
    • Elastoplastic finite element analysis of three-dimensional fatigue crack growth in aluminum shafts subjected to axial loading
    • de-Andres A, Perez JL, Ortiz M (1999) Elastoplastic finite element analysis of three-dimensional fatigue crack growth in aluminum shafts subjected to axial loading. Int J Solids Struct 36:2231-2258
    • (1999) Int J Solids Struct , vol.36 , pp. 2231-2258
    • de-Andres, A.1    Perez, J.L.2    Ortiz, M.3
  • 5
    • 0031996766 scopus 로고    scopus 로고
    • Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints
    • Desai CS, Basaran C, Dishong T, Prince JL (1998) Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints. IEEE Trans Comp Packag Manuf Technol B 21:87-97
    • (1998) IEEE Trans Comp Packag Manuf Technol B , vol.21 , pp. 87-97
    • Desai, C.S.1    Basaran, C.2    Dishong, T.3    Prince, J.L.4
  • 6
    • 33846568998 scopus 로고    scopus 로고
    • On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
    • De Vries JWC, Jansen MY, Van Driel WD (2007) On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. J Microelectron Reliab 47:444-449
    • (2007) J Microelectron Reliab , vol.47 , pp. 444-449
    • De Vries, J.W.C.1    Jansen, M.Y.2    Van Driel, W.D.3
  • 7
    • 50549180512 scopus 로고
    • Yielding in steel sheets containing slits
    • Dugdale DS (1960) Yielding in steel sheets containing slits. J Mech Phys Solids 8:100-104
    • (1960) J Mech Phys Solids , vol.8 , pp. 100-104
    • Dugdale, D.S.1
  • 8
    • 56349097882 scopus 로고    scopus 로고
    • Thermomechanical fatigue failure of interfaces in lead-free solders
    • PhD Dissertation, Eindhoven University of Technology
    • Erinc M (2007) Thermomechanical fatigue failure of interfaces in lead-free solders. PhD Dissertation, Eindhoven University of Technology
    • (2007)
    • Erinc, M.1
  • 10
    • 27244460240 scopus 로고    scopus 로고
    • Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures
    • Erinc M, Schreurs PJG, Zhang GQ, Geers MGD (2005) Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures. J Mater Sci Mater Electron 16:93-100
    • (2005) J Mater Sci Mater Electron , vol.16 , pp. 93-100
    • Erinc, M.1    Schreurs, P.J.G.2    Zhang, G.Q.3    Geers, M.G.D.4
  • 11
    • 34447292862 scopus 로고    scopus 로고
    • Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints
    • Erinc M, Schreurs PJG, Geers MGD (2007) Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints. Int J Solids Struct 44:5680-5694
    • (2007) Int J Solids Struct , vol.44 , pp. 5680-5694
    • Erinc, M.1    Schreurs, P.J.G.2    Geers, M.G.D.3
  • 12
    • 45849133746 scopus 로고    scopus 로고
    • Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder joints
    • Erinc M, Schreurs PJG, Geers MGD (2008) Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder joints. Mech Mater 40:780-791
    • (2008) Mech Mater , vol.40 , pp. 780-791
    • Erinc, M.1    Schreurs, P.J.G.2    Geers, M.G.D.3
  • 15
    • 33745712125 scopus 로고    scopus 로고
    • Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages
    • In: Berlin, 2007
    • Lai YS, Wang TH, Lee CC (2005) Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages. In: Proceedings of EuroSimE, Berlin, 2007
    • (2005) Proceedings of EuroSimE
    • Lai, Y.S.1    Wang, T.H.2    Lee, C.C.3
  • 16
    • 0033904050 scopus 로고    scopus 로고
    • Solder joint fatigue models: Review and applicability to chip scale packages
    • Lee WW, Nguyen LT, Selvaduray GS (2000) Solder joint fatigue models: review and applicability to chip scale packages. Microelectron Reliab 40:231-244
    • (2000) Microelectron Reliab , vol.40 , pp. 231-244
    • Lee, W.W.1    Nguyen, L.T.2    Selvaduray, G.S.3
  • 17
    • 33846603220 scopus 로고    scopus 로고
    • Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies
    • Li X, Wang Z (2007) Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies. J Mater Process Technol 18:6-12
    • (2007) J Mater Process Technol , vol.18 , pp. 6-12
    • Li, X.1    Wang, Z.2
  • 18
    • 23144455436 scopus 로고    scopus 로고
    • Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy
    • Matin A, Coenen EWC, Vellinga WP, Geers MGD (2006) Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy. Scr Mater 53:927-932
    • (2006) Scr Mater , vol.53 , pp. 927-932
    • Matin, A.1    Coenen, E.W.C.2    Vellinga, W.P.3    Geers, M.G.D.4
  • 19
    • 0024982575 scopus 로고
    • An analysis of decohesion along an imperfect interface
    • Needleman A (1990) An analysis of decohesion along an imperfect interface. Int J Fract 42:21-40
    • (1990) Int J Fract , vol.42 , pp. 21-40
    • Needleman, A.1
  • 20
    • 0037218278 scopus 로고    scopus 로고
    • An irreversible cohesive zone model for interface fatigue crack growth simulation
    • Roe KL, Siegmund T (2003) An irreversible cohesive zone model for interface fatigue crack growth simulation. Eng Fract Mech 70:209-232
    • (2003) Eng Fract Mech , vol.70 , pp. 209-232
    • Roe, K.L.1    Siegmund, T.2
  • 21
    • 1542397798 scopus 로고    scopus 로고
    • Effect of anisotropy of tin on thermomechanical behavior of solder joints
    • Subramanian KN, Lee JG (2004) Effect of anisotropy of tin on thermomechanical behavior of solder joints. J Mater Sci Mater Electron 15:235-240
    • (2004) J Mater Sci Mater Electron , vol.15 , pp. 235-240
    • Subramanian, K.N.1    Lee, J.G.2
  • 22
    • 56349113430 scopus 로고    scopus 로고
    • Crack opening displacement approach to assess multiaxial low cycle fatigue
    • Tchankov D, Sakane M, Itoh T, Hamada N (2008) Crack opening displacement approach to assess multiaxial low cycle fatigue. Int J Fatigue 29:1996-2004
    • (2008) Int J Fatigue , vol.29 , pp. 1996-2004
    • Tchankov, D.1    Sakane, M.2    Itoh, T.3    Hamada, N.4
  • 23
    • 0038451605 scopus 로고    scopus 로고
    • Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications
    • Tee TY, Ng HS, Yap D, Baraton X, Zhong Z (2003) Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectron Reliab 43:1117-1123
    • (2003) Microelectron Reliab , vol.43 , pp. 1117-1123
    • Tee, T.Y.1    Ng, H.S.2    Yap, D.3    Baraton, X.4    Zhong, Z.5
  • 25
    • 16344384568 scopus 로고    scopus 로고
    • A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces
    • Towashiraporn P, Subbarayan G, Desai CS (2005) A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces. Int J Solids Struct 42:4468-4483
    • (2005) Int J Solids Struct , vol.42 , pp. 4468-4483
    • Towashiraporn, P.1    Subbarayan, G.2    Desai, C.S.3
  • 26
    • 11344273356 scopus 로고    scopus 로고
    • Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II - Aged condition
    • Vianco PT, Rejent JA, Kilgo AC (2004) Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II-aged condition. J Electron Mater 33:1473-1484
    • (2004) J Electron Mater , vol.33 , pp. 1473-1484
    • Vianco, P.T.1    Rejent, J.A.2    Kilgo, A.C.3
  • 27
    • 56349167260 scopus 로고    scopus 로고
    • Website: accessed July
    • Website: http://www.circuitnet.com/articles/article_40062.shtml, accessed July 2008
    • (2008)
  • 28
    • 6344278527 scopus 로고    scopus 로고
    • Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
    • Wiese S, Wolter KJ (2004) Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectron Reliab 44:1923-1931
    • (2004) Microelectron Reliab , vol.44 , pp. 1923-1931
    • Wiese, S.1    Wolter, K.J.2
  • 29
    • 42649098594 scopus 로고    scopus 로고
    • Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
    • Zhang X, Kripesh V, Chai TC, Tan TC, Pinjala D (2008) Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron Reliab 48:602-610
    • (2008) Microelectron Reliab , vol.48 , pp. 602-610
    • Zhang, X.1    Kripesh, V.2    Chai, T.C.3    Tan, T.C.4    Pinjala, D.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.