Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 250-257

  Jicheng, Gong ^a   Changqing, Liu ^a   Conway, Paul P ^a   Silberschmidt, Vadim V ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COOLING; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; GRAIN SIZE AND SHAPE; POLYCRYSTALLINE MATERIALS; SOLDERING ALLOYS;

ANISOTROPIC PROPERTIES; GRAIN FEATURES; INELASTIC BEHAVIOR; MICRO JOINTS;

SOLDERED JOINTS;

EID: 33845587988     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645655     Document Type: Conference Paper

References (8)

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3. LaLonde, A. et al, "Quantitative metallography of β-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy," J. Electron. Mater., Vol. 33, No. 12 (2004), pp. 1545-1549
4. Telang, A. U. et al, "Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens," Scripta Mater., Vol. 52, No. 10 (2005), pp. 1027-1031
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6. Kerr, M. et al, "Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales, " Acta Mater., Vol. 52, No. 15 (2004), pp. 4527-4535
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8. Ochoa, F. et al, "Effects of cooling rate on creep behavior of Sn-3.5Ag Alloy, " J. Electron. Mater., Vol. 33, No. 12 (2004), pp. 1596-1607