메뉴 건너뛰기




Volumn , Issue , 2007, Pages

The dependence of composition, cooling rate and size on the solidification behaviour of SnAgCu solders

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; GRAIN SIZE AND SHAPE; INGOTS; MICROSTRUCTURE; SOLIDIFICATION;

EID: 36348999815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.359953     Document Type: Conference Paper
Times cited : (19)

References (17)
  • 2
    • 0038688846 scopus 로고    scopus 로고
    • Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories
    • New Orleans, Louisiana
    • Lehman, L.P.; Kinyanjui, R.K.; Zavalij, L.; Zribi, A.; Cotts, E.J.: "Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories" Proc IEEE 53th Electronic Components and Technology Conference, New Orleans, Louisiana, 2003, pp. 1215-1221.
    • (2003) Proc IEEE 53th Electronic Components and Technology Conference , pp. 1215-1221
    • Lehman, L.P.1    Kinyanjui, R.K.2    Zavalij, L.3    Zribi, A.4    Cotts, E.J.5
  • 3
    • 0942266959 scopus 로고    scopus 로고
    • Ochoa, F.; Williams, J.J.; Chawla, N.: Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.% Solder Journal of Electronic Materials, 32 (12/2003), pp. 1414-1420.
    • Ochoa, F.; Williams, J.J.; Chawla, N.: "Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.% Solder" Journal of Electronic Materials, Vol. 32 (12/2003), pp. 1414-1420.
  • 4
    • 25844438737 scopus 로고    scopus 로고
    • Microstructure and mechanical properties of lead free solders and solder joints used in microelectronic applications
    • Kang, S.K.; Choi, W.K.; Shi, D.-Y.; Henderson, D.W.; Puttlitz, K.J.: "Microstructure and mechanical properties of lead free solders and solder joints used in microelectronic applications" Journal of Research and Development, Vol. 49 (2005), pp. 607-619.
    • (2005) Journal of Research and Development , vol.49 , pp. 607-619
    • Kang, S.K.1    Choi, W.K.2    Shi, D.-Y.3    Henderson, D.W.4    Puttlitz, K.J.5
  • 5
    • 36348933118 scopus 로고    scopus 로고
    • Metallurgy division of the Material Science and Engineering Laboratory, Ag-Cu-Sn Phase Diagram & Computational Thermodynamics, http://www.metallurgy.nist.gov/phase/solder/agcusn.html, Date: 2006-04-11.
    • Metallurgy division of the Material Science and Engineering Laboratory, "Ag-Cu-Sn Phase Diagram & Computational Thermodynamics", http://www.metallurgy.nist.gov/phase/solder/agcusn.html, Date: 2006-04-11.
  • 6
    • 33646390119 scopus 로고    scopus 로고
    • Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects
    • Lu, H.Y.; Balkan, H.; Ng, K.Y.S.: "Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects" Journal of Material Science: Mater Electron, Vol 17 (2006), pp. 171-188.
    • (2006) Journal of Material Science: Mater Electron , vol.17 , pp. 171-188
    • Lu, H.Y.1    Balkan, H.2    Ng, K.Y.S.3
  • 8
    • 0004246021 scopus 로고
    • neubearbeitete und erweiterte Auflage, Springer Berlin, Heidelberg
    • Haasen, P. Physikalische Metallkunde 3., neubearbeitete und erweiterte Auflage, Springer (Berlin, Heidelberg, 1994), pp. 188-212.
    • (1994) Physikalische Metallkunde 3 , pp. 188-212
    • Haasen, P.1
  • 9
    • 29944445466 scopus 로고    scopus 로고
    • Heat transfer and solidification processes of alloy melt with undercooling: I. Experimental Results
    • Yoslioka, H.; Tada, Y; Kunimine, K.; Furuichi, T.; Hayashi, Y.: "Heat transfer and solidification processes of alloy melt with undercooling: I. Experimental Results" Acta Materialia, Vol. 54 (2005), pp. 757-763.
    • (2005) Acta Materialia , vol.54 , pp. 757-763
    • Yoslioka, H.1    Tada, Y.2    Kunimine, K.3    Furuichi, T.4    Hayashi, Y.5
  • 14
    • 24644437399 scopus 로고    scopus 로고
    • Aggarwal, Ankur O.; Raj, P. Markondeya; Sundaram, Venky; Ravi, D.; Koh, Sauwee; Mullapudi, Ravi; Tummala, Rao R.: 50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Paekage Nano Interconnects Proc IEEE 55th Electronic Components and Technology Conference, Orlando, FL, 2005, pp. 1139-1146.
    • Aggarwal, Ankur O.; Raj, P. Markondeya; Sundaram, Venky; Ravi, D.; Koh, Sauwee; Mullapudi, Ravi; Tummala, Rao R.: "50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Paekage Nano Interconnects" Proc IEEE 55th Electronic Components and Technology Conference, Orlando, FL, 2005, pp. 1139-1146.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.