-
1
-
-
85046983650
-
3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu
-
3Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu" Journal of Metals, (6/2006), pp. 61-65.
-
(2006)
Journal of Metals
, vol.6
, pp. 61-65
-
-
Kang, S.K.1
Lauro, P.A.2
Shi, D.-Y.3
Henderson, D.W.4
Gosselih, T.5
Sarkhel, A.6
Goldsmith, C.7
Puttlitz, K.J.8
-
2
-
-
0038688846
-
Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories
-
New Orleans, Louisiana
-
Lehman, L.P.; Kinyanjui, R.K.; Zavalij, L.; Zribi, A.; Cotts, E.J.: "Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories" Proc IEEE 53th Electronic Components and Technology Conference, New Orleans, Louisiana, 2003, pp. 1215-1221.
-
(2003)
Proc IEEE 53th Electronic Components and Technology Conference
, pp. 1215-1221
-
-
Lehman, L.P.1
Kinyanjui, R.K.2
Zavalij, L.3
Zribi, A.4
Cotts, E.J.5
-
3
-
-
0942266959
-
-
Ochoa, F.; Williams, J.J.; Chawla, N.: Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.% Solder Journal of Electronic Materials, 32 (12/2003), pp. 1414-1420.
-
Ochoa, F.; Williams, J.J.; Chawla, N.: "Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.% Solder" Journal of Electronic Materials, Vol. 32 (12/2003), pp. 1414-1420.
-
-
-
-
4
-
-
25844438737
-
Microstructure and mechanical properties of lead free solders and solder joints used in microelectronic applications
-
Kang, S.K.; Choi, W.K.; Shi, D.-Y.; Henderson, D.W.; Puttlitz, K.J.: "Microstructure and mechanical properties of lead free solders and solder joints used in microelectronic applications" Journal of Research and Development, Vol. 49 (2005), pp. 607-619.
-
(2005)
Journal of Research and Development
, vol.49
, pp. 607-619
-
-
Kang, S.K.1
Choi, W.K.2
Shi, D.-Y.3
Henderson, D.W.4
Puttlitz, K.J.5
-
5
-
-
36348933118
-
-
Metallurgy division of the Material Science and Engineering Laboratory, Ag-Cu-Sn Phase Diagram & Computational Thermodynamics, http://www.metallurgy.nist.gov/phase/solder/agcusn.html, Date: 2006-04-11.
-
Metallurgy division of the Material Science and Engineering Laboratory, "Ag-Cu-Sn Phase Diagram & Computational Thermodynamics", http://www.metallurgy.nist.gov/phase/solder/agcusn.html, Date: 2006-04-11.
-
-
-
-
6
-
-
33646390119
-
Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects
-
Lu, H.Y.; Balkan, H.; Ng, K.Y.S.: "Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects" Journal of Material Science: Mater Electron, Vol 17 (2006), pp. 171-188.
-
(2006)
Journal of Material Science: Mater Electron
, vol.17
, pp. 171-188
-
-
Lu, H.Y.1
Balkan, H.2
Ng, K.Y.S.3
-
7
-
-
0036665771
-
Interfacial Reaction Studies on Lead (Pb)-Free Solder Alloys
-
Kang, S. K.; Shi, D.Y.; Fogel, K.; Lauro, P.; Yim, M.-J.; Advocate, G.G. Jr.; Griffin, M.; Goldsmith, C.; Henderson, D.W.; Gosselin, T.A.; King, D.E.; Konrad, JJ.;. Sarkhel, A.; Puttlitz, K.J.: "Interfacial Reaction Studies on Lead (Pb)-Free Solder Alloys" IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25 (2002), pp. 155-161.
-
(2002)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.25
, pp. 155-161
-
-
Kang, S.K.1
Shi, D.Y.2
Fogel, K.3
Lauro, P.4
Yim, M.-J.5
Advocate Jr., G.G.6
Griffin, M.7
Goldsmith, C.8
Henderson, D.W.9
Gosselin, T.A.10
King, D.E.11
Konrad, J.J.12
Sarkhel, A.13
Puttlitz, K.J.14
-
8
-
-
0004246021
-
-
neubearbeitete und erweiterte Auflage, Springer Berlin, Heidelberg
-
Haasen, P. Physikalische Metallkunde 3., neubearbeitete und erweiterte Auflage, Springer (Berlin, Heidelberg, 1994), pp. 188-212.
-
(1994)
Physikalische Metallkunde 3
, pp. 188-212
-
-
Haasen, P.1
-
9
-
-
29944445466
-
Heat transfer and solidification processes of alloy melt with undercooling: I. Experimental Results
-
Yoslioka, H.; Tada, Y; Kunimine, K.; Furuichi, T.; Hayashi, Y.: "Heat transfer and solidification processes of alloy melt with undercooling: I. Experimental Results" Acta Materialia, Vol. 54 (2005), pp. 757-763.
-
(2005)
Acta Materialia
, vol.54
, pp. 757-763
-
-
Yoslioka, H.1
Tada, Y.2
Kunimine, K.3
Furuichi, T.4
Hayashi, Y.5
-
10
-
-
10444263718
-
Qualification of SnAg Solder Bumps for Lead-free Flip Chip Applications
-
Las Vegas, NV
-
Ebersberger, B.; Bauer, R.; Alexa, L.: "Qualification of SnAg Solder Bumps for Lead-free Flip Chip Applications" Proc IEEE 54th Electronic Components and Technology Conference, Las Vegas, NV, 2004, pp. 683-691.
-
(2004)
Proc IEEE 54th Electronic Components and Technology Conference
, pp. 683-691
-
-
Ebersberger, B.1
Bauer, R.2
Alexa, L.3
-
13
-
-
42549095514
-
Optimisation Modelling for Design of Advanced Interconnects
-
Dresden, NV
-
Stoyanov, S.; Bailey, C.: "Optimisation Modelling for Design of Advanced Interconnects" Proc 1st Electronic Systemintegration Technology Conference, Dresden, NV, 2006, pp. 203-208.
-
(2006)
Proc 1st Electronic Systemintegration Technology Conference
, pp. 203-208
-
-
Stoyanov, S.1
Bailey, C.2
-
14
-
-
24644437399
-
-
Aggarwal, Ankur O.; Raj, P. Markondeya; Sundaram, Venky; Ravi, D.; Koh, Sauwee; Mullapudi, Ravi; Tummala, Rao R.: 50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Paekage Nano Interconnects Proc IEEE 55th Electronic Components and Technology Conference, Orlando, FL, 2005, pp. 1139-1146.
-
Aggarwal, Ankur O.; Raj, P. Markondeya; Sundaram, Venky; Ravi, D.; Koh, Sauwee; Mullapudi, Ravi; Tummala, Rao R.: "50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Paekage Nano Interconnects" Proc IEEE 55th Electronic Components and Technology Conference, Orlando, FL, 2005, pp. 1139-1146.
-
-
-
-
16
-
-
22944465234
-
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
-
Orlando, FL
-
Lehman, L.P.; Kinyanjui, R.K.; Wang, Y.; Xing, L.; Zavalij, P.; Borgesen, P.; Cotts, E.J.: "Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints" Proc IEEE 55th Electronic Components and Technology Conference, Orlando, FL, 2005, pp. 674-681.
-
(2005)
Proc IEEE 55th Electronic Components and Technology Conference
, pp. 674-681
-
-
Lehman, L.P.1
Kinyanjui, R.K.2
Wang, Y.3
Xing, L.4
Zavalij, P.5
Borgesen, P.6
Cotts, E.J.7
-
17
-
-
33845568149
-
Influence of Sn Grain Size and Orientation on the Thermodynamical Response and Reliability of Pb-free Solder Joints
-
San Diego, CA
-
Bieler, T.R.; Jiang, H.; Lehman, L.P.; Krikpatriek, T.; Cotts, E.J.: "Influence of Sn Grain Size and Orientation on the Thermodynamical Response and Reliability of Pb-free Solder Joints" Proc IEEE 56th Electronic Components and Technology Conference, San Diego, CA, 2006, pp. 1462-1467.
-
(2006)
Proc IEEE 56th Electronic Components and Technology Conference
, pp. 1462-1467
-
-
Bieler, T.R.1
Jiang, H.2
Lehman, L.P.3
Krikpatriek, T.4
Cotts, E.J.5
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