Effect of Ni on the formation of Cu6Sn5 and Cu 3Sn intermetallics

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1204-1209

  Yu, Hao ^a   Vuorinen, Vesa ^a   Kivilahti, Jorma ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; NICKEL; THERMODYNAMICS; TIN COMPOUNDS;

CONSTANT MOBILITIES; DIFFUSION KINETIC; KIRKENDALL VOID FORMATION;

INTERMETALLICS;

EID: 33845588973     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645805     Document Type: Conference Paper

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