Interfacial adhesion between rough surfaces of polycrystalline silicon and its implications for M/NEMS technology

Journal of Adhesion Science and Technology

Volumn 24, Issue 15-16, 2010, Pages 2545-2556

  Laboriante, Ian ^a   Bush, Brian ^a   Lee, Donovan ^b   Liu, Fang ^a   Liu, Tsu Jae King ^b   Carraro, Carlo ^a,c   Maboudian, Roya ^a,c  

^a University of California   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c INM LEIBNIZ INSTITUTE FOR NEW MATERIALS   (Germany)

Author keywords

Adhesion; apparent work of adhesion; double clamped cantilever beam; MEMS; NEMS; reliability; rough surfaces; stiction

Indexed keywords

ADHESION FORCES; APPARENT CONTACT AREA; APPARENT WORK OF ADHESION; APPLIED BIAS; BEAM TESTS; DEVICE GEOMETRIES; DOUBLE-CLAMPED CANTILEVER BEAM; FABRICATION PROCESS; INTERFACIAL ADHESIONS; LINEAR DEPENDENCE; MICROMETER SCALE; OPTICAL INTERFEROMETRIC METHOD; POLY-CRYSTALLINE SILICON; RIGID MATERIAL; ROUGH SURFACES; TEST STRUCTURE;

ATOMIC FORCE MICROSCOPY; CANTILEVER BEAMS; ELECTROSTATIC ACTUATORS; NANOCANTILEVERS; PILE FOUNDATIONS; POLYSILICON; STICTION; SURFACE MEASUREMENT; SURFACES;

ADHESION;

EID: 77957843018     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/016942410X508262     Document Type: Article

References (44)

1. R. Maboudian and R. T. Howe, J. Vac. Sci. Technol., B 15, 1 (1997).
2. R. Maboudian and C. Carraro, Annu. Rev. Phys. Chem. 55, 35 (2004).
3. W. R. Ashurst, M. P. de Boer, C. Carraro and R. Maboudian, Appl. Surface Sci. 212-213, 735 (2003).
4. R. Maboudian, Surface Sci. Rep. 30, 209 (1998).
5. R. Maboudian and R. T. Howe, Tribology Lett. 3, 215 (1997).
6. M. R. Houston, R. Maboudian and R. T. Howe, J. Appl. Phys. 81, 3474 (1997).
7. B. Bhushan and M. T. Dugger, Wear 137, 41 (1990).
8. F. W. DelRio, M. P. de Boer, J. A. Knapp, E. D. Reedy Jr, P. J. Clews and M. L. Dunn, Nature Mater. 4, 629 (2005).
9. J. A. Greenwood and J. B. P. Williamson, Proc. R. Soc. London, Ser. A 295, 300 (1966).
10. A. Kohno and S. Hyodo, J. Phys. D: Appl. Phys. 7, 1243 (1974).
11. A. L. Weisenhorn, P. K. Hansma, T. R. Albrecht and C. F. Quate, Appl. Phys. Lett. 54, 2651 (1989).
12. W. A. Ducker, T. J. Senden and R. M. Pashley, Nature 353, 239 (1991).
13. M. Kappl and H.-J. Butt, Particle Particle Syst. Char. 19, 129 (2002).
14. D. J. Dickrell III, M. T. Dugger, M. A. Hamilton and W. G. Sawyer, J. Microelectromech. Syst. 16, 1263 (2007).
15. R. A. Quon, R. F. Knarr and T. K. Vanderlick, J. Phys. Chem. B 103, 5320 (1999).
16. M. Benz, K. J. Rosenberg, E. J. Kramer and J. N. Israelachvili, J. Phys. Chem. B 110, 11884 (2006).
17. S. Majumder, N. E. McGruer, G. G. Adams, P. M. Zavracky, R. H. Morrison and J. Krim, Sensors Actuators A 93, 19 (2001).
18. K. Komvopoulos, Wear 200, 305 (1996).
19. A. Mikrajuddin, F. G. Shi, H. K. Kim and K. Okuyama, Mater. Sci. Semicond. Process. 2, 321 (1999).
20. M. P. de Boer and T. A. Michalske, J. Appl. Phys. 86, 817 (1999).
21. C. H. Mastrangelo and C. H. Hsu, in: Proc. IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, USA, p. 208 (1992).
22. C. H. Mastrangelo, Tribology Lett. 3, 223 (1997).
23. R. Legtenberg, H. A. C. Tilmans, J. Elders and M. Elwenspoek, Sensors Actuators A 43, 230 (1994).
24. X. Rottenberg, I. de Wolf, B. K. J. C. Nauwelaers, W. de Raedt and H. A. C. Tilmans, J. Micro-electromech. Syst. 16, 1243 (2007).
25. K. Najafi and K. Suzuki, in: Proc. IEEE Micro Electro Mechanical Systems, Salt Lake City, Utah, USA, p. 96 (1989).
26. W. Y. Choi, T. Osabe and T.-J. K. Liu, IEEE Trans. Electron Devices 55, 3482 (2008).
27. L. Kogut and K. Komvopoulos, J. Appl. Phys. 94, 6386 (2003).
28. T. R. Thomas, B.-G. Rosen and N. Amini, Wear 232, 41 (1999).
29. A. Majumdar and B. Bhushan, J. Tribology 113, 1 (1991).
30. P. R. Nayak, J. Lubrication Technol. 93, 398 (1971).
31. V. Bakolas, Wear 254, 546 (2003).
32. M. Ciavarella, G. Demelio, J. R. Barber and Y. H. Yang, Proc. R. Soc. London, Ser. A 456, 387 (2000).
33. K. L. Johnson, Contact Mechanics. Cambridge University Press, London (1998).
34. C. M. Mate, Tribology on the Small Scale. Oxford University Press, New York (2008).
35. M. P. de Boer and P. C. T. de Boer, J. Colloid Interface Sci. 311, 171 (2007).
36. J. I. McCool, Wear 107, 37 (1986).
37. A. W. Bush, R. D. Gibson and T. R. Thomas, Wear 35, 87 (1975).
38. D. Bachmann and C. Hierold, J. Micromech. Microeng. 17, 1326 (2007).
39. F. W. DelRio, M. L. Dunn, L. M. Phinney, C. J. Bourdon and M. P. de Boer, Appl. Phys. Lett. 90, 163104 (2007).
40. R. Maboudian, W. R. Ashhurst and C. Carraro, Tribology Lett. 12, 95 (2002).
41. J. Zhang, PhD Dissertation, University of California, Berkeley (2007).
42. B. G. Bush, F. W. DelRio, J. O. Opatkiewicz, R. Maboudian and C. Carraro, J. Phys. Chem. A 111, 12339 (2007).
43. V. K. Varadan, K. J. Vinoy and K. A. Jose, RF MEMS and Their Applications. John Wiley & Sons, Hoboken, New Jersey (2003).
44. Q. Jing, T. Mukherjee and G. K. Fedder, in: Proc. IEEE/ACM Int. Conf. on Computer Aided Design, San Jose, CA, USA, p. 367, November 10-14 (2002).