Yield behavior of moderately filled epoxy/Ni suspensions

Journal of Adhesion Science and Technology

Volumn 24, Issue 11-12, 2010, Pages 1929-1948

  Zhou, Jianguo ^a   Sancaktar, Erol ^a  

^a University of Akron   (United States)

Author keywords

epoxy ni suspension; rheology; Yielding

Indexed keywords

ARRHENIUS EQUATION; BISPHENOL A; DETERMINATION METHODS; ELECTRICAL CONDUCTIVITY; EPOXY/NI SUSPENSION; FLOCCULATED STRUCTURE; INTEGRATED CIRCUIT PACKAGING; LOWER COST; NANO POWDERS; RESIN VISCOSITY; SHEAR RATES; SHEAR THINNING; SOLID LOADING; STRESS DETERMINATION; TEMPERATURE DEPENDENCE; VAN DER WAALS ATTRACTION; YIELD BEHAVIORS; YIELD STRESS VALUE; YIELDING;

ACTIVATION ENERGY; ADHESIVES; ELASTICITY; ELECTRIC CONDUCTIVITY; FLOCCULATION; FRACTAL DIMENSION; PACKAGING MATERIALS; PHENOLS; RESINS; RHEOLOGY; SHEAR DEFORMATION; SILVER; STRESS ANALYSIS; SUSPENSIONS (FLUIDS); VAN DER WAALS FORCES; VISCOSITY;

YIELD STRESS;

EID: 77956598983     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/016942410X507669     Document Type: Conference Paper

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