Use of polymeric emeraldine salt for conductive adhesive applications

Journal of Adhesion Science and Technology

Volumn 17, Issue 9, 2003, Pages 1265-1282

  Sancaktar, Erol ^a   Liu, Chengjun ^a  

^a University of Akron   (United States)

Author keywords

Aluminum plating; Electrical conduction; Electrically conductive adhesive; Emeraldine salt; PANI; Percolation volume; Polyaniline; Pressure dependent resistivity; Silver plating; Single lap joints; Viscoelasticity; Zinc plating

Indexed keywords

ALUMINUM PLATING; ELECTRIC CONDUCTANCE; ELECTROCHEMISTRY; OXIDATION; REDOX REACTIONS; VISCOELASTICITY; ZINC PLATING; ALUMINUM; AMMONIUM COMPOUNDS; ELECTRIC CONDUCTIVITY; FILLERS; INDUSTRIAL APPLICATIONS; NITROCELLULOSE; OPTICAL PROPERTIES; SILVER PLATING; SOLVENTS; SUBSTRATES; ZINC;

CONDUCTIVE ADHESIVES;

ADHESIVES; POLYANILINE;

ELECTRICAL CONDUCTION; ELECTRICALLY CONDUCTIVE ADHESIVES; EMERALDINE SALT; PANI; SINGLE LAP JOINTS;

EID: 0041733240     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103322114570     Document Type: Article

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