Rheological characterization of a solder paste for surface mount applications

Rheologica Acta

Volumn 45, Issue 4, 2006, Pages 374-386

  Billotte, Catherine ^a   Carreau, Pierre J ^a   Heuzey, Marie Claude ^a  

^a DEPARTMENT OF CHEMICAL ENGINEERING   (Canada)

Author keywords

Solder paste; Suspension; Thixotropy; Vane geometry; Yield stress

Indexed keywords

CHARACTERIZATION; CREEP; POWDER METALS; RHEOLOGY; SOLDERING; SURFACE MOUNT TECHNOLOGY; VISCOELASTICITY; YIELD STRESS;

EID: 33745125894     PISSN: 00354511     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00397-005-0053-3     Document Type: Article

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