Evaluating carbon nanotube global interconnects for chip multiprocessor applications

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 18, Issue 9, 2010, Pages 1376-1380

  Pasricha, Sudeep ^a   Kurdahi, Fadi J ^b   Dutt, Nikil ^b  

^a Department of Environmental and Radiological Health Sciences   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Carbon nanotubes; chip multiprocessors; global interconnects; system level design

Indexed keywords

CHIP MULTIPROCESSOR; CHIP MULTIPROCESSORS; CU-BASED; CU-INTERCONNECTS; DEEP SUBMICROMETER; ENERGY CONSUMPTION; FABRICATION TECHNOLOGIES; GLOBAL COMMUNICATION; GLOBAL INTERCONNECTS; MULTICORE CHIPS; ON CHIPS; PERFORMANCE BOTTLENECKS; SYSTEM LEVEL DESIGN; SYSTEM LEVEL EVALUATION;

COMMUNICATION; ENERGY UTILIZATION; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; MULTIPROCESSING SYSTEMS; SYSTEMS ANALYSIS;

CARBON NANOTUBES;

EID: 77956227092     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2009.2024118     Document Type: Article

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