Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects

International Workshop on System Level Interconnect Prediction, SLIP

Volumn , Issue , 2007, Pages 81-88

  Cho, Hoyeol ^a   Koo, Kyung Hoae ^a   Kapur, Pawan ^a   Saraswat, Krishna C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Bandwidth density; Carbon nanotube; Cu; Global interconnects; Latency; Optics; Power

Indexed keywords

BANDWIDTH; CAPACITANCE; ENERGY DISSIPATION; INTEGRATED CIRCUITS; OPTICAL INTERCONNECTS; WAVELENGTH DIVISION MULTIPLEXING;

BANDWIDTH DENSITY; CROSSOVER SWITCHING; GLOBAL INTERCONNECTS; SYSTEM PARAMETERS;

CARBON NANOTUBES;

EID: 34748917552     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1231956.1231973     Document Type: Conference Paper

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