Investigating the design, performance, and reliability of multi-walled carbon nanotube interconnect

Proceedings of the 9th International Symposium on Quality Electronic Design, ISQED 2008

Volumn , Issue , 2008, Pages 691-696

  Nieuwoudt, Arthur ^a   Massoud, Yehia ^a  

^a Rice University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN METHODS; ELECTRONIC DESIGNS; INTERCONNECT SOLUTIONS; INTERNATIONAL SYMPOSIUM; LARGE DIAMETER; MULTI-WALLED CARBON NANOTUBE; NANO SCALING; NANO TUBE; PROCESS VARIATIONS; QUANTITATIVE DESIGN; RLC MODEL; SINGLE-WALLED CARBON NANOTUBE;

CARBON; CHEMICAL SENSORS; ELECTRONICS ENGINEERING; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; NANOPORES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTECHNOLOGY; NANOTUBES; SINGLE-WALLED CARBON NANOTUBES (SWCN);

CARBON NANOTUBES;

EID: 49749095673     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2008.4479821     Document Type: Conference Paper

References (18)

1. ITRS, International Technology Roadmap for Semiconductors, 2005.
2. Y. Massoud and A. Nieuwoudt, "Modeling and Design Challenges and Solutions for Carbon Nanotube-Based Interconnect in Future High Performance Integrated Circuits," ACM J. Emerg. Tech. Comp. Sys., pp. 155-196, 2006.
3. J. W. G. Wildoeer et al., "Electronic Structure of Atomically Resolved Carbon Nanotubes," Nature, pp. 59-61, 1998.
4. H. J. Li et al., "Multichannel Ballistic Transport in Multiwall Carbon Nanotubes," Phys. Rev. Lett., p. 086601, 2005.
5. Y. Awano, "Carbon Nanotube Technologies for LSI via Interconnects," IEICE Trans. Elec., pp. 1499-1503, 2006.
6. A. Naeemi and J. D. Meindl, "Compact Physical Models for Multiwall Carbon-Nanotube Interconnects," IEEE Elect. Dev. Lett., pp. 338-340, 2006.
7. A. Nieuwoudt and Y. Massoud, "Evaluating the Impact of Resistance in Carbon Nanotube Bundles for VLSI Interconnect using Diameter-Dependent Modeling Techniques," IEEE Trans. Elect. Dev., pp. 2460-2466, 2006.
8. A. Nieuwoudt and Y. Massoud, "Understanding the Impact of Inductance in Carbon Nanotube Bundles for VLSI Interconnect using Scalable Modeling Techniques," IEEE Trans. Nano., pp. 758-765, 2006.
9. A. Nieuwoudt and Y. Massoud, "RC Circuit Model for Multi-Walled Carbon Nanotubes," in Proc. IEEE Conf. Nano., 2007, pp. 660-663.
10. A. Naeemi, R. Savari, and J. D. Meindl, "Performance Modeling and Optimization for Single- and Multi-Wall Carbon Nanotube Interconnects," in Proc. IEEE/ACM DAC, 2007, pp. 568-573.
11. A. Raychowdhury and K. Roy, "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison with Cu Interconnects for Scaled Technologies," IEEE Trans. CAD, pp. 58-65, 2006.
12. C. Berger, Y. Yi, Z. L. Wang, and W. A. de Heer, "Multiwalled Carbon Nanotubes Are Ballistic Conductors at Room Temperature," Appl. Phys. A, pp. 363-365, 2002.
13. P. Poncharal et al., "Room Temperature Ballistic Conduction in Carbon Nanotubes," J. Phys. Chem. B, pp. 12104-12118, 2002.
14. H. Kajiura, H. Huang, and A. Bezryadin, "Quasi-Ballistic Electron Transport in Double-Wall Carbon Nanotubes," Chem. Phys. Lett., pp. 476-479, 2004.
15. M. Tsutsui, S. Mitsuya, S. Kurokawa, and A. Sakai, "Conductance Versus Bias Voltage Characteristics of Multi-Walled Carbon Nanotubes," Nanotechnology, pp. 1863-1867, 2005.
16. B. Q. Wei, R. Vajtai, and P. M. Ajayan, "Reliability and Current Carrying Capacity of Carbon Nanotubes," Appl. Phys. Lett., pp. 1172-1174, 2001.
17. S. Nassif, "Modeling and Analysis of Manufacturing Variations," in Proc. IEEE CICC, 2001, pp. 223-228.
18. A. Nieuwoudt and Y. Massoud, "On the Impact of Process Variations for Carbon Nanotube Bundles for VLSI Interconnect," IEEE Trans. Elect. Dev., pp. 446-455, 2007.