Densification of carbon nanotube bundles for interconnect application

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 201-203

  Liu, Z ^a   Bajwa, N ^a   Ci, L ^a   Lee, S H ^a   Kar, S ^a   Ajayan, P M ^a   Lu, J Q ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DENSIFICATION; ELECTRIC POWER SYSTEM INTERCONNECTION; EVAPORATION; GROWTH (MATERIALS);

BUNDLE STRUCTURE PARAMETERS; POST-GROWTH PROCESSING; SOLVENT EVAPORATION;

CARBON NANOTUBES;

EID: 34748836557     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382389     Document Type: Conference Paper

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