Preliminary Experiments of Cu Interconnect Preparation by Magnetically Transported-Shielded Cathodic Arc Deposition

IEEJ Transactions on Fundamentals and Materials

Volumn 123, Issue 5, 2003, Pages 462-467

  Miyakawa, Nobuhide ^a   Minamisawa, Shinji ^a   Takikawa, Hirofumi ^a   Sakakibara, Tateki ^a   Marunaka, Masao ^b   Doi, Toshiya ^b  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b ShinMaywa Industries Ltd   (Japan)

Author keywords

cathodic arc deposition; Cu film; deposition rate; plasma magnetic transportation; shielded method; wiring

Indexed keywords

EID: 77955454147     PISSN: 03854205     EISSN: 13475533     Source Type: Journal    
DOI: 10.1541/ieejfms.123.462     Document Type: Article

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