Low-temperature deposited Cu electrode on chip inductors by abnormal glow discharge plasma with arc source

Materials Letters

Volumn 54, Issue 2-3, 2002, Pages 217-221

  Wang, Yaowen ^a   Zhang, Hongguo ^a   Chen, Qiang ^a   Pan, Junde ^b   Li, Longtu ^a  

^a TSINGHUA UNIVERSITY   (China)

^b TAIYUAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Abnormal glow discharge; Chip inductors; Cu electrode; Electric arc; Low temperature deposition

Indexed keywords

ADHESION; COPPER; DIFFUSION; ELECTRIC ARCS; ELECTRODEPOSITION; ELECTRODES; ENERGY DISPERSIVE SPECTROSCOPY; GLOW DISCHARGES; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY;

MULTILAYER CHIP INDUCTORS (MLCI);

SURFACE MOUNT TECHNOLOGY;

EID: 0036571139     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(01)00566-3     Document Type: Article

References (8)