Preparation of copper films by metal organic chemical vapor deposition on various substrates

Materials Science and Engineering B: Solid-State Materials for Advanced Technology

Volumn 72, Issue 2, 2000, Pages 184-188

  Cho, Nam Ihn ^a   Sul, Yongtae ^b  

^a SunMoon University   (South Korea)

^b Hoseo University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HELIUM; METALLORGANIC CHEMICAL VAPOR DEPOSITION; POLYAMIDES; SILICON; SUBSTRATES; TEMPERATURE; TITANIUM NITRIDE; TUNGSTEN; VAPOR PRESSURE;

COPPER FILMS; PHYSICAL VAPOR DEPOSITION;

THIN FILMS;

EID: 0033904958     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(99)00510-3     Document Type: Article

References (8)

1. Jain A., Kodas T.T., Jairath R., Hampden-Smith M.J. J. Vac. Sci. Technol. 11:1993;2107.
2. Lee W.J., Min J.S., Rha S.K., Lee Y.J., Kim W.S., Kim D.W., Park C. J. Korean Vacuum Soc. 4:1995;164.
3. K. Yuda, K. Sera, F. Uesugi, I. Nishiyama, F. Okumura, International Electron Device Meeting, 519 (1994).
4. Kouno T., Niwa H., Yamada M. J. Electrochem. Soc. 145:1998;2164.
5. Lee W., Rha S., Lee S., Park C. J. Electrochem. Soc. 144:1997;2164.
6. Cho N.I., Park D.I., Kim C.K., Kim Y.S. J. Korean Assoc. Crystal Growth. 6:1996;318.
7. Cho N.I., Park D.I. Thin Solid Films. 308:1997;465.
8. Cho E.S., Park S.K., Shin H.K., Lee H.H. Appl. Phys. Lett. 68:1996;1017.