Role of SPS in chloride ions and PEG additive system for copper electrocrystallisation

Transactions of the Institute of Metal Finishing

Volumn 88, Issue 3, 2010, Pages 144-148

  Gu, M ^a   Li, Q ^a   Fu, B H ^a   Xian, X H ^a  

^a CHONGQING UNIVERSITY   (China)

Author keywords

Copper; Electrocrystallisation; Electrodeposition; PEG Cl ; PEG Cl SPS; SPS

Indexed keywords

CHLORIDE IONS; CHRONOAMPEROMETRY TECHNIQUES; ELECTROCRYSTALLISATION; ELECTRODEPOSITION POTENTIAL; GLASSY CARBON ELECTRODES; NEGATIVE POTENTIAL; NUCLEATION MECHANISM; NUMBER DENSITY; PEG ADDITIVE; PROGRESSIVE NUCLEATION; SODIUMSULFOPROPYL; SULPHATES; THREE-DIMENSIONAL GROWTH;

CHLORINE COMPOUNDS; CHRONOAMPEROMETRY; COPPER; ELECTRODEPOSITION; GLASS MEMBRANE ELECTRODES; GLASSY CARBON; NUCLEATION; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; THREE DIMENSIONAL;

CYCLIC VOLTAMMETRY;

EID: 77954916648     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591910X12692576434572     Document Type: Conference Paper

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