Progress of copper electrocrystallization

Progress in Chemistry

Volumn 20, Issue 4, 2008, Pages 483-490

  Li, Qiang ^a   Gu, Min ^a   Xian, Xiaohong ^a  

^a CHONGQING UNIVERSITY   (China)

Author keywords

Copper; Electrocrystallization; Electrodeposition; Nucleation mechanism

Indexed keywords

EID: 43749107256     PISSN: 1005281X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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