Electrocrystallization of copper in the presence of PEG-Cl- additive

Acta Chimica Sinica

Volumn 65, Issue 10, 2007, Pages 881-886

  Gu, Min ^a   Li, Qiang ^a   Xian, Xiao Hong ^b   Qing, Sheng Lan ^a   Liu, Ke Wan ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^b CHONGQING UNIVERSITY   (China)

Author keywords

Cu; Electrocrystallization; Electrodeposition; GCE; PEG Cl

Indexed keywords

EID: 77951929415     PISSN: 05677351     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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