150μm pitch Pb-free flipchip packaging with Cu/low-k interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 100-106

  Yoon, Seung Wook ^a   Kripesh, Vaidyanathan ^a   Viswanath, Akella ^b   Li, Hong Yu ^a   Iyer, Mahadevan K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BUMP SHEAR TEST; REDISTRIBUTION PROCESS; STRUCTURAL STABILITY; THICK PHOTORESISTS;

CHEMICAL VAPOR DEPOSITION; COPPER; OPTICAL INTERCONNECTS; PERMITTIVITY; SOLDERING; TITANIUM;

FLIP CHIP DEVICES;

EID: 24644495326     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Lei L. Mercado, Cindy Goldberg, Shun-Meen Kuo, Tien-Yu Lee and Scott K. Pozder, "Analysis of flipchip packaging challenges on copper/low-k interconnectes," IEEE transactions on device and materials reliability, Vol. 3, No.4, Dec. 2003
2. International Technology Roadmap for Semiconductors, 2001 and 2003 Update.
3. Senug Wook Yoon, Vaidyanathan Kripesh, Wong Wai Kwan, Li Chao Yong, Chen Xian Tong, Gui Dong, Ingnatius J Rasiah and Mahadevan K. Iyer,"UBM Integrity Studies on Copper/low-k Dielectrics for Fine Pitch Flip Chip Packaging", Proceeding of 53rd Electronic Components & Technology Conference, New Orleans, US (2003).
4. Seung Wook Yoon, Vaidyanathan Kripesh, Li Hongyu,Li Chao Yong, Su Yong Ji Jeffrey and Mahadevan K. Iyer, "Flipchip Bump Integrity with Copper/Ultra Low-k Dielectrics for fine pitch Flipchip Packaging", Proceeding of the 54th Electronic Components Technology Conference(ECTC), Las Vegas, US (2004).
5. Surface Evolver, http://www.geom.uiuc.edu/software/download/evolver. html, http://www.susqu.edu/facstaff/b/brakke/evolver/
6. Akella G.K.Viswanath, Wang Fang, Tai-Chong Chai, Navas Khan and Srinivasamurthy Sampath, "Structural optimization of fine pitch, large die flip chip package," proceeding of EPTC, December 2005.