Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 4, 2006, Pages 1780-1784

  Arunasalam, Parthiban ^a   Ackler, Harold D ^a   Sammakia, Bahgat G ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SIGNAL TRANSMISSION; SMART THREE AXIS COMPLIANT (STAC); THROUGH-SILICON VIAS (TSV); ULTRAHIGH DENSITY WAFER-LEVEL THIN FILM;

BATCH DATA PROCESSING; FABRICATION; MAGNETRON SPUTTERING; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; THIN FILMS;

WSI CIRCUITS;

EID: 33746559781     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2210003     Document Type: Article

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