Flip-chip process using interlocking-bump joints

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 909-914

  Oh, Tae Sung ^a   Lee, Kwang Yong ^b   Won, Hye Jin ^b  

^a Hong Ik University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Chip shear force; Contact resistance; Cu bump; Flip chip; Interlocking bump; Sn bump

Indexed keywords

CHIP SHEAR FORCE; CU BUMPS; FLIP CHIP; SHEAR FORCE; SN BUMPS;

CONTACT RESISTANCE; TIN;

FLIP CHIP DEVICES;

EID: 72149113584     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2015594     Document Type: Article

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