High power impulse magnetron sputtering and related discharges: Scalable plasma sources for plasma-based ion implantation and deposition

Surface and Coatings Technology

Volumn 204, Issue 18-19, 2010, Pages 2864-2868

  Anders, André ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

High power impulse magnetron sputtering; Plasma sources; Plasma based ion implantation and deposition; Review

Indexed keywords

FILTERED CATHODIC ARC PLASMAS; FLUX OF IONS; HIGH-POWER; LOW BIAS; LOW DUTY-CYCLES; MAGNETRON SPUTTERING PLASMA; PLASMA BASED ION IMPLANTATION AND DEPOSITION; PROCESS GAS; PULSED-POWER; SPUTTERED ATOMS; SPUTTERING TECHNIQUES; SPUTTERING TECHNOLOGY; THIN-FILM DEPOSITIONS;

DEPOSITION; ELECTRIC DISCHARGES; ION IMPLANTATION; MAGNETRON SPUTTERING; METAL IONS; PLASMA SOURCES;

PLASMA DEPOSITION;

EID: 77953359012     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.01.047     Document Type: Article

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