The effect of the microstructure and the surface topography on the electrical properties of thin Ag films deposited by high power pulsed magnetron sputtering

Surface and Coatings Technology

Volumn 202, Issue 11, 2008, Pages 2323-2327

  Sarakinos, K ^a   Wordenweber J ^a   Uslu, F ^a   Schulz, P ^a   Alami, J ^b   Wuttig, M ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b CemeCon AG   (Germany)

Author keywords

Conductivity; HiPIMS; HPPMS; Silver films

Indexed keywords

ELECTRIC CONDUCTIVITY; MAGNETRON SPUTTERING; METALLOGRAPHIC MICROSTRUCTURE; SILVER; SURFACE TOPOGRAPHY; THIN FILMS;

ELECTRONIC TRANSPORT; HIGH POWER PULSED MAGNETRON SPUTTERING; SILVER FILM;

INORGANIC COATINGS;

ELECTRIC CONDUCTIVITY; INORGANIC COATINGS; MAGNETRON SPUTTERING; METALLOGRAPHIC MICROSTRUCTURE; SILVER; SURFACE TOPOGRAPHY; THIN FILMS;

EID: 38949086883     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.08.028     Document Type: Article

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