Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

Journal of Materials Science

Volumn 40, Issue 12, 2005, Pages 3149-3154

  Shigetou, A ^a   Itoh, T ^a   Suga, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; FABRICATION; LSI CIRCUITS; OXIDATION; RELAXATION PROCESSES; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ATOMIC-LEVEL INTERCONNECTIONS; DIRECT BONDING; SURFACE ACTIVATED BONDING (SAB); VACUUM PRESSURE;

METALLIC FILMS;

EID: 20644439083     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-2677-1     Document Type: Conference Paper

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