Pyramid bumps for fine-pitch chip-stack interconnection

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 4 B, 2005, Pages 2751-2755

  Watanabe, Naoya ^a   Ootani, Youhei ^a   Asano, Tanemasa ^a  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Bump; Bump transfer method; Compliant bump; Flip chip bonding; Interconnection; Microconnect; Pyramid bump; System in package; Three dimensional integration

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; PRESSURE EFFECTS; RELIABILITY; STRAIN;

BUMP; BUMP TRANSFER METHOD; COMPLIANT BUMP; FLIP-CHIP BONDING; INTERCONNECTION; MICROCONNECTS; PYRAMID BUMP; SYSTEM IN PACKAGE; THREE-DIMENSIONAL INTEGRATION;

INTERCONNECTION NETWORKS;

EID: 21244491138     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.2751     Document Type: Conference Paper

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