Foil level packaging of a chemical gas sensor

Journal of Micromechanics and Microengineering

Volumn 20, Issue 5, 2010, Pages

  Courbat, J ^a   Briand, D ^a   De Rooij, N F ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL GAS SENSORS; DRY PROCESS; FABRICATED DEVICE; FABRICATION COST; GAS MEASUREMENT; GAS SENSORS; GENERIC METHOD; LARGE-SCALE FABRICATION; PACKAGING TECHNIQUES; PLASTIC FOILS; POLYMERIC DEVICES; POLYMERIC STRUCTURES; ROLL-TO-ROLL PROCESSING; SENSING DEVICES; WAFER LEVEL;

CHEMICAL SENSORS; COST REDUCTION; FABRICATION; GAS DETECTORS; GAS PERMEABLE MEMBRANES; GASES; LAMINATING; PACKAGING; PLASTICS; POLYMERIC GLASS; POLYMERS; SILICON WAFERS;

ELECTRONICS PACKAGING;

EID: 77951955169     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/5/055026     Document Type: Article

References (30)

1. Lawes R A 2007 Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques Microsyst. Technol. 13 85-95
2. Wolffenbuttel R F and Wise K D 1994 Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature Sensors Actuators A 43 223-9
3. Wei J, Xie H, Nai M L, Wong C K and Lee L C 2003 Low temperature wafer anodic bonding J. Micromech. Microeng. 13 217-22
4. Barth P W 1990 Silicon fusion bonding for fabrication of sensors, actuators and microsystructures Sensors Actuators A 21-23 919-26
5. Yang H-A, Wu M and Fang W 2005 Localized induction heating solder bonding for wafer level MEMS packaging J. Micromech. Microeng. 15 394-9
6. Gao Y and Doumanidis C 2002 Mechanical analysis of ultrasonic bonding for rapid prototyping J. Manuf. Sci. Eng. 124 426-34
7. Kim J, Jeong B, Chiao M and Lin L 2009 Ultrasonic bonding for MEMS sealing and packaging IEEE Trans. Adv. Packag. 32 461-7
8. Niklaus F, Stemme G, Lu J-Q and Gutmann R J 2006 Adhesive wafer bonding J. Appl. Phys. 99 031101
9. Oberhammer J and Stemme G 2005 BCB contact printing for patterned adhesive full-wafer bonded 0-level packages J. Microelectromech. Syst. 14 419-25
10. Celeste J R 1969 Process for making photoresists US Patent 3,469,982
11. http://www2.dupont.com/Imaging-Materials/en-US/products/ dryfilmPhotoresist/fx.html
12. http://www.elgaeurope.it/
13. http://www.eternal-group.com/en/service-1-5.html
14. http://www.asahi-kasei.co.jp/ake-mate/dfr/en/index.htm
15. Lorenz H, Paratte L, Luthier R, de Rooij N F and Renaud P 1996 Low-cost technology for multilayer electroplated parts using laminated dry film resist Sensors Actuators A 53 364-8
16. Kukharenka E, Farooqui M M, Grigore L, Kraft M and Hollinshead N 2003 Electroplating moulds using dry film thick negative resist J. Micromech. Microeng. 13 S67-74
17. Guijt R M, Candish E and Breadmore M C 2009 Dry film microchips for miniaturised separations Electrophoresis 30 4219-24
18. Vulto P, Glade N, Altomare L, Bablet J, Del Tin L, Medoro G, Chartier I, Manaresi N, Tartagni M and Guerrieri R 2005 Microfluidic channel fabrication in dry film resist for production and prototyping of hybrid chips Lab Chip 5 158-62
19. Vulto P, Huesgen T, Albrecht B and Urban G A 2009 A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist J. Micromech. Microeng. 19 077001
20. Leech P W, Wu N and Zhu Y 2009 Application of dry film resist in the fabrication of microfluidic chips for droplet generation J. Micromech. Microeng. 19 065019
21. Radadia A D, Cao L, Jeong H-K, Shannon M A and Masel R I 2007 A 3D micromixer fabricated with dry film resist Proc. MEMS 2007 Conf. (Kobe, Japan, 21-25 January 2007) pp 361-4
22. Jung M-Y, Jang W I, Choi C A, Lee M R, Jun C H and Kim Y T 2004 Novel lithography process for extreme deep trench by using laminated negative dry film resist Proc. MEMS 2004 Conf. (Maastricht, The Netherlands, 25-29 January 2004) pp 685-8
23. Jiang L-T, Huang T-C, Chang C-Y, Ciou J-R, Yang S-Y and Huang P-H 2008 Direct fabrication of rigid microstructures on a metallic roller using dry film resist J. Micromech. Microeng. 18 015004
24. Briand D, Colin S, Gangadharaiah A, Vela E, Dubois P, Thiery L and de Rooij N F 2006 Micro-hotplates on polyimide for sensors and actuators Sensors Actuators A 132 317-24
25. Briand D, Colin S, Courbat J, Raible S, Kappler J and de Rooij N F 2008 Integration of MOX gas sensors on polyimide hotplates Sensors Actuators B 130 430-5
26. Courbat J, Canonica M D, Teyssieux D, Thiery L, Briand D, Cretin B and de Rooij N F 2008 Thermal simulation and characterization for the design of ultra-low power micro-hotplates on flexible substrate Proc. IEEE Sensors 2008 Conf. (Lecce, Italy, 26-29 October 2008) pp 74-7
27. Raible S, Briand D, Kappler J and de Rooij N F 2006 Wafer level packaging of micromachined gas sensors IEEE Sensors J. 6 1232-5
28. Courbat J, Briand D, Yue L, Raible S and de Rooij N F 2009 Ultra-low power metal oxide gas sensor on plastic foil Proc. Transducers 2009 Conf. (Denver, CO, USA, 21-25 June 2009) pp 584-7
29. Simon I, Brsan N, Bauer M and Weimar U 2001 Micromachined metal oxide gas sensors: opportunities to improve sensor performance Sensors Actuators B 73 1-26
30. Wlodek S, Colbow K and Consadori F 1991 Signal-shape analysis of a thermally cycled tin-oxide gas sensor Sensors Actuators B 3 63-8