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Volumn 5, Issue 2, 2005, Pages 158-162

Microfluidic channel fabrication in dry film resist for production and prototyping of hybrid chips

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE AGENT;

EID: 13844321259     PISSN: 14730197     EISSN: None     Source Type: Journal    
DOI: 10.1039/b411885e     Document Type: Article
Times cited : (171)

References (13)
  • 1
    • 0032403465 scopus 로고    scopus 로고
    • Rapid prototyping of microfluidic systems in poly(dimethylsiloxane)
    • D. C. Duffy, J. C. McDonald, O. A. J. Schueller and G. M. Whitesides, Rapid prototyping of microfluidic systems in poly(dimethylsiloxane), Anal. Chem., 1998, 70, 4974-4984.
    • (1998) Anal. Chem. , vol.70 , pp. 4974-4984
    • Duffy, D.C.1    McDonald, J.C.2    Schueller, O.A.J.3    Whitesides, G.M.4
  • 3
    • 0035369397 scopus 로고    scopus 로고
    • Fabrication techniques to realize CMOS-compatible microfluidic microchannels
    • A. Rasmussen, M. Gaitan, L. E. Locascio and M. E. Zaghloul, Fabrication techniques to realize CMOS-compatible microfluidic microchannels, J. Microelectromech. Syst., 2001, 10(2), 286-297.
    • (2001) J. Microelectromech. Syst. , vol.10 , Issue.2 , pp. 286-297
    • Rasmussen, A.1    Gaitan, M.2    Locascio, L.E.3    Zaghloul, M.E.4
  • 4
    • 1642603474 scopus 로고    scopus 로고
    • Review on micromolding of thermoplastic polymers
    • M. Heckele and W. K. Schomburg, Review on micromolding of thermoplastic polymers, J. Micromech. Microeng., 2004, 14, R1-R14.
    • (2004) J. Micromech. Microeng. , vol.14
    • Heckele, M.1    Schomburg, W.K.2
  • 8
    • 0038477339 scopus 로고    scopus 로고
    • Low-cost technology for multiple layer electroplated parts using laminated dry film resist
    • H. Lorenz, L. Paratte, R. Luthier, N. F. de Rooij and P. Renaud, Low-cost technology for multiple layer electroplated parts using laminated dry film resist, Sens. Actuators A, 1996, 53, 364-368.
    • (1996) Sens. Actuators A , vol.53 , pp. 364-368
    • Lorenz, H.1    Paratte, L.2    Luthier, R.3    De Rooij, N.F.4    Renaud, P.5
  • 10
    • 0035392881 scopus 로고    scopus 로고
    • Powder-blasting technology as an alternative tool for micro-fabrication of CE-chips with integrated conductivity sensors
    • S. Schlautmann, H. Wensink, R. B. M. Schasfoort, M. C. Elwenspoek and A. van den Berg, Powder-blasting technology as an alternative tool for micro-fabrication of CE-chips with integrated conductivity sensors, J. Micromech. Microeng., 2001, 11, 386-389.
    • (2001) J. Micromech. Microeng. , vol.11 , pp. 386-389
    • Schlautmann, S.1    Wensink, H.2    Schasfoort, R.B.M.3    Elwenspoek, M.C.4    Van Den Berg, A.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.