Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques

Microsystem Technologies

Volumn 13, Issue 1, 2007, Pages 85-95

  Lawes, R A ^a  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; COST EFFECTIVENESS; EXCIMER LASERS; INDUSTRIAL APPLICATIONS; OPTICAL RESOLVING POWER; REACTIVE ION ETCHING;

ACTUATION PERFORMANCE; MANUFACTURING COSTS; MICROFABRICATION TECHNIQUES; SPATIAL RESOLUTION;

MICROELECTROMECHANICAL DEVICES;

EID: 33750329979     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0252-6     Document Type: Article

References (15)

1. Chuang YF, Tseng FG, Lin WK (2002) Reduction of diffraction effect of UV exposure on SU-8 negative thick photo resist by Air- gap elimination. Microsyst Technol 8:308-313
2. Ehrfeld W, Schmidt A (1998) Recent developments in deep X-ray lithography. J Vac Sci Technol B 16(6):3526-3534
3. Elwenspoek M, Jansen H (1998) Silicon Microengineering Cambridge Studies in Semiconductor Physics and Microelectronics Engineering No. 7
4. Goodall R, Fandel, Allan A, Landler P, Huff H (2002) Longterm productivity mechanisms of the semiconductor industry. In: Semiconductor silicon 2002 proceedings, 9th edn. Electrochemical Society
5. Gower MC (2001) Laser micromachining for MEMS devices. Proc SPIE 4559:53-59
6. Griffiths SK (2004) Fundamental limitations of LIGA X-ray lithography: sidewall offset, slope and minimum feature size. J Micromech Microeng 14(7):999-1011
7. Laermer F, Urban A (2003) Challenges, developments and applications of silicon deep reactive ion etching. Microelectron Eng 67-68:349-355
8. Lawes RA (2003) The central microstructure facility, http://www.cmf.rl. ac.uk
9. Lawes R A (2005) Manufacturing tolerances for UV LIGA using SU-8 Resist. J Micromech Microeng 15:2198-2203
10. Lawes RA, Arthur GG (2004) LIGA for boomerang. Device and process technologies for microelectronics, MEMS and photonics. SPIE 5276:307-317
11. Lee K et al (1995) Micromachining applications of high resolution ultra-thick resist. J Vac Sci Tech B 13(6):3012-3016
12. Linder C, Jaecklin V, de Rooij NF (1992) Surface micromachining. J Micromech Microeng 2:122-132
13. Rumsby P, Harvey E, Thomas D, Rizvi N (1997) Excimer laser patterning of thick and thin films for high density packaging. Proc SPIE 3184:176-185
14. Schmidt MA (1998) Wafer-to-wafer bonding for microstructure formation. Proc IEEE 86(8):575-1585
15. Zhang J, Chan Park MB, Connor SR (2004) Effect of exposure dose on the replication fidelity and profile of very high aspect ratio microchannels in SU-8. Lab Chip 4:646-653