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Volumn 19, Issue 7, 2009, Pages

A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist

Author keywords

[No Author keywords available]

Indexed keywords

APPLYING PRESSURE; DIRECT BONDING; DRY FILM RESIST; MICROFLUIDIC CHANNEL; MICROFLUIDIC CHIP; WAFER FABRICATIONS;

EID: 68249138761     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/7/077001     Document Type: Article
Times cited : (67)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.